The SUSS MA6 Mask Aligner is capable of aligning and exposing substrates from 50 mm to 150 mm in diameter using a 400 nm 350W UV lamp. Its very good exposure field uniformity and light intensity control can give submicron image resolution results in vacuum contact mode with proper attention to photolithography process and substrate cleanliness standards. Two exposure intensity channels are provided over which the user can vary the time of exposure for proper image sharpness. An additional integrating radiometer can be used to meter UV dosage to tailor exposures to the photoresist manufacturers specifications. Backside alignment using topside and bottomside video cameras is possible. Dual cameras on both sides facilitate rapid mask to substrate alignment. Please contact the facility manager before ordering masks for use with this machine.